Second Herald of Korea, Samsung has just hired a high-ranking TSMC employee, namely Lin Jun-cheng. He worked for the Taiwanese company for about 19 years and was at Micron Technology before that. This is serious background.
Lin Jun-cheng will lead Samsung’s Advanced Packaging Team, part of the Device Solutions division, which is an essential part of chip development. He has been working on developing 3D packaging technology for TSMC, so this could be a big hit for the Korean tech giant.
While quite capable, Samsung’s Exynos chipsets for smartphones have often been criticized. Qualcomm’s chips are often more powerful overall, thanks to the Adreno GPU, while TSMC’s manufacturing process is arguably more efficient. So this year’s Galaxy S series in a Snapdragon variant has been a long time coming.
The latest rental suggests that Samsung is restructuring and will try again soon. If Lin Jun-cheng can turn things around, it would potentially attract some much-needed customers, such as Apple and Qualcomm, who now mostly stick to TSMC.
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