TSMC detailed its chip development history at the 2022 TSMC Technology Symposium.
The Taiwan-based chip maker will introduce 3nm chips in the second half of this year and bring 2nm technology to the world stage in 2025.
The 3nm node will be available in five tiers, each more powerful, denser than transistors and more efficient: N3, N3E (Enhanced), N3P (Performance Enhanced), N3S (Density Enhanced), and N3X (Ultra High Performance).
As for the 2nm node, it will increase performance by 10% to 15% at the same power draw and bring 25% to 30% lower consumption at the same frequency and number of transistors, compared to the N3E node. N2 increases the chip density compared to N3E by 1.1 times.
TSMC introduced GAAFETs (gate-all-around field effect transistors). The new nanosheet transistors will increase performance per watt by reducing resistance.
Meanwhile, Samsung Foundry will also start mass production of 3nm chips in 2022, but plans to start manufacturing 2nm chips in 2025 as well.
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